Hello,

I'm making process where I would like to evaporate Ti/Pt/Au on GaAs/AlGaAs
system and use Ti/Pt/Au as a RIE etch mask. However ion-bombardment in RIE
damages my Au layer and causes sputtering of Au around my sample.

I was thinking that it could be possible to have Cr as a mask layer so I
would evaporate Ti/Pt/Au/Cr and use that as a etch mask. However after RIE
etch I should be able to strip Cr without damaging GaAs / AlGaAs layers or
my Ti/Pt/Au. Actually I can live with some damage to metals or AlGaAs but
GaAs can't be etched in any way.

Do you any good formulations for Cr stripping that would be selective on
GaAs / AlGaAs and Ti/Pt/Au?


Best regards,
-Jukka Viheriala