HCl:H2O (1:1) or HCl:HNO3:H2O (1:1:3) will etch Ni although i'm not sure if
they will etch the copper. I've seen a copper etch using H2SO4 and H2O2 so
you should be ok with that.

Greg Chance
Bath University Physics

--On 06 May 2004 18:51 -0700 Sandy Kumar  wrote:

> I am looking for a chemical wet process etchant to etch nickel from
> copper substrate. Nickel is about 200 microinch thick plating. Could
> anyone please help?
> Thanks.
> Sandy
>
>
>
>
>
> ---------------------------------
> Do you Yahoo!?
> Win a $20,000 Career Makeover at Yahoo! HotJobs