hi,

I have nickel microstructures in a PMMA mold on a
silicon substrate. I tried releasing the Ni structures
embedded in the PMMA mold by etching si (backside)
using KOH at 80 C. The silicon was etched but the KOH
(30%) attacked the PMMA also. I dont want to use a
temperature higher that 95 C as it will damage the
PMMA. I am hoping one of the following will work:

1. etchant which does not attach pmma/ni but removes
si
2. way to polish the whole si wafer. I used a very
coarse grit (80) silicon carbide paper on a polishing
machine but it took a long time and the wafer and the
pmma was mechanically damaged.

If anyone has tried these methods or can point to a
possible solution, I would appreciate it.

Thanks,

Abhinav




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