Dear Sir/Madam,

        I am febricating an Accelerometer.I have two part one is cantilever with
tip and other is Base electrode assembly.I have to bond ,two parts. Could you
please tell me the best bonding method between gold layer(1000A)and SiO2
layer(0.8 um).

Thanks & Regards

Debasish PaulIndiatimes Email now powered by APIC Advantage. Help!
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