Hello,
for this kind of application you can try to bond directly the Au layer onto
the SiO2. my concern in this case is the thickness of the gold layer. It
should be in a range of 3000 to 4000A. Temperature should be around 370°C.
if you want to have further information please contact me directly.

Erwin Mit freundlichen Gruessen,
Sinceres salutations,
I nostri cordiali saluti,
Yours sincerely,
------------------------------------------------------------------
SUSS MicroTec
Hell Erwin
Product Specialist
Aligner & Bond Systems
Schleissheimerstr.90
D-85748 Garching
Germany
**********************************
Tel.    +49 (0) 89 32007 307
Fax.    +49 (0) 89 32007 162
Cell:   +49 (0) 170 5386531
Email:  [email protected]
Int:    http://www.suss.com


Message: 5
Date: Wed, 02 Jun 2004 10:41:25 +0530
From: "dpkgp" 
Subject: [mems-talk] Need help in Bonding
To: 
Message-ID: <[email protected]>
Content-Type: text/plain; charset=us-ascii

 Dear Sir/Madam,

        I am febricating an Accelerometer.I have two part one is cantilever
with tip and other is Base electrode assembly.I have to bond ,two parts.
Could you please tell me the best bonding method between gold
layer(1000A)and SiO2 layer(0.8 um).

Thanks & Regards

Debasish PaulIndiatimes Email now powered by APIC Advantage. Help!
HelpClick on the image to chat with me


------------------------------