Debasish,
If your design depends on direct contact between the gold and the oxide, then
you may have some difficulties ahead, as gold does not adhere very well to
oxide. In addition, the oxide will serve as a barrier layer to a gold eutectic
bonding process, as it will provide a barrier between the gold and the pure
silicon (which together will form a liquid at 363C - the eutectic point of the
gold-silicon system).
One possibility would be to actually sputter a gold pattern on top of the oxide
(using some sort of adhesion layer, such as Ti, Cr, etc.), and perform a direct
gold-gold thermocompression bond. Further details on this process can be found
in this reference:
"Wafer-Level Thermocompression Bonds" by Tsau, Schmidt, and Spearing at MIT,
from Advanced Materials for Micro- and Nano-Systems (AMMNS), Jan 2003.
Another possibility is the use of polymer as an intermediate layer for bonding.
We've developed processes for bonding of patterned BCB layers and of patterned
SU-8 layers, just to name a couple.
Best Regards,
Chad Brubaker
EV Group invent * innovate * implement
Technology - Tel: (602) 437-9492, Fax: (602)437-9435 e-mail:
[email protected], www.EVGroup.com
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-----Original Message-----
From: [email protected] [mailto:mems-talk-
[email protected]] On Behalf Of dpkgp
Sent: Tuesday, June 01, 2004 10:11 PM
To: [email protected]
Subject: [mems-talk] Need help in Bonding
Dear Sir/Madam,
I am febricating an Accelerometer.I have two part one is cantilever with
tip and other is Base electrode assembly.I have to bond ,two parts. Could you
please tell me the best bonding method between gold layer(1000A)and SiO2
layer(0.8 um).
Thanks & Regards
Debasish PaulIndiatimes Email now powered by APIC Advantage. Help!
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