Josef,

If classical sawing creates a problem you can use a dual beam FIB to create
the cross-section.  If you don't have access to such a tool you could try
scribing the back side and the cleaving it.

Jon Hiller


Jon M. Hiller
Argonne National Laboratory
Electron Microscopy Center
Materials Science Division
Tel:  630-252-9558
Fax:  630-252-4289


-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Josef
Kouba
Sent: Wednesday, June 09, 2004 8:08 AM
To: MEMS Submission
Subject: [mems-talk] How to make an SEM sample?

Dear colleagues,

anyone knows how to prepare following sample?

material: soft-baked SU-8 resist (>1mm) on top of an Si wafer (500 um)
sample form: stripes 20 - 50 um thick, cutting plane perpendicular to the
wafer (total size of a sample = (Si thickness + resist thickness) x 20 - 50
um)
special requirements: minimal heat production during the sample preparation

classical saw technique will probably not work because of the heat

Does anyone have any suggestions or does anyone know somebody who could
help?

Thanks a lot

Best regards

Josef Kouba
BESSY GmbH, AZM Group
Albert-Einstein-Strasse 15
12489 Berlin
Tel.: +49 30 6392 3125
Fax.: +49 30 6392 4682
[email protected]
www.azm.bessy.de


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