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MEMSnet Home: MEMS-Talk: SU8-silicon bonding
SU8-silicon bonding
2004-06-10
Cédricmargo
2004-06-10
Brubaker Chad
RIE on polymer material
2004-06-11
Hengcw
2004-06-11
Isaac Wing Tak Chan
SU8-silicon bonding
Cédricmargo
2004-06-10
Hello,
 I want to make a microfluidic chip for biological analyses. The chip
would be made like this:
A SU8 layer is patterned by lithography onto a glass wafer to form a
channel and reservoirs(typically, dimensions are 20µm*20µm for the
smallest part of the channel).
After that, a silicon wafer through etched (KOH) to form fluidic and
electrical connexions would be bonded to the SU8 layer by heating of
this last.

I have still doubts about this step. So, I would appreciate any
suggestion or related links about bonding of SU8 on silicon after the
SU8 has been patterned by UV exposition.

Best regards


--
Cédric Margo - [email protected]
Laboratoire d'Instrumentation Electronique de Nancy
Faculté des Sciences et Techniques
Boulevard des Aiguillettes - BP 239
54506 Vandoeuvre les Nancy - FRANCE
Tel:03 83 68 41 56
fax:03 83 68 41 53
http://www.lien.uhp-nancy.fr




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