Cedric,
A good article to refer to on SU-8 bonding would be as follows:
S.K. Sampath, L.St.Clair, Xingtao Wu, D.V. Ivanov, Q. Wang, C.Ghosh, and
K.R.Farmer, "Rapid MEMS Prototyping Using SU-8, Wafer Bonding and Deep Reactive
Ion Etching,: Proceedings of the 14th Biennial University/Government/Industry
Microelectronics Symposium, Richmond, VA, June 17-20, 2001 - IEEE Catalog No.
01CH37197
This article specifically deals with the bonding of patterned SU-8 to an etched
silicon substrate.
Best Regards,
Chad Brubaker
EV Group invent * innovate * implement
Technology - Tel: (602) 437-9492, Fax: (602)437-9435 e-mail:
[email protected], www.EVGroup.com
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-----Original Message-----
From: [email protected] [mailto:mems-talk-
[email protected]] On Behalf Of Cédric margo
Sent: Thursday, June 10, 2004 12:49 AM
To: [email protected]
Subject: [mems-talk] SU8-silicon bonding
Hello,
I want to make a microfluidic chip for biological analyses. The chip
would be made like this:
A SU8 layer is patterned by lithography onto a glass wafer to form a
channel and reservoirs(typically, dimensions are 20µm*20µm for the
smallest part of the channel).
After that, a silicon wafer through etched (KOH) to form fluidic and
electrical connexions would be bonded to the SU8 layer by heating of
this last.
I have still doubts about this step. So, I would appreciate any
suggestion or related links about bonding of SU8 on silicon after the
SU8 has been patterned by UV exposition.
Best regards
--
Cédric Margo - [email protected]
Laboratoire d'Instrumentation Electronique de Nancy
Faculté des Sciences et Techniques
Boulevard des Aiguillettes - BP 239
54506 Vandoeuvre les Nancy - FRANCE
Tel:03 83 68 41 56
fax:03 83 68 41 53
http://www.lien.uhp-nancy.fr
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