Hi,

For development purposes, we will sometimes cut through 20-30 microns
thickness in a swath that is over 100 microns wide by 50 microns long (so
that at 45-degree SEM angle, we can view into the hole).

Obviously the penalty is FIB time required.  Especially if you are forced to
out-source your FIB work at approx $300 an hour.  I think the above cut and
polish to get a good image could take as long as 8-12 hours.

- Justin

Justin C. Borski
MEMS Program Manager
Advanced MicroSensors Inc.
[email protected]





-----Original Message-----
From: Josef Kouba [mailto:[email protected]]
Sent: Friday, June 11, 2004 3:25 AM
To: General MEMS discussion
Subject: Re: [mems-talk] How to make an SEM sample?


Hi Jon,

do you know how if there are any restrictions of FIB cutting regrding the
thickness of the cutted material?

Thanks

J.


> Josef,
> If classical sawing creates a problem you can use a dual beam FIB to
create
> the cross-section.  If you don't have access to such a tool you could try
> scribing the back side and the cleaving it.
> Jon Hiller



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