hi members,
could some one help me?
for su-8 on Si wafer, i want to put a conductive layer
on the wafer before su-8 for electroplating,
only the prebake and post bake will change?
am i correct to increase the baking time or i have to increase the temp?
thanks
chenhan
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Chen-Han Lee
Research Student
School of Manufacturing and Mechanical Engineering,
University of Birmingham,
Birmingham, B15 2TT
United Kingdom,
Phone : +44 121 4144245
Fax : +44 121 4143958
E-Mail : [email protected]
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