Mahvir,
   I have run into exactly the same problem with 2 micron, low stress
LPCVD nitride released over an area of 7.5mm x 7.5mm. I diced before
DRIE. This is actually handy since you can pick only the "good" devices
for further processing. Also it allows you to arrange the die on the
handle wafer so that uniformity is optimized decreasing the beating your
stop layer will take during processing. Unfortunately, I found that the
tensile stresses in the film were simply too high and the support arms
for the suspended device would consistently fail at the corners.

Good luck,
   Mike Martin

>>> [email protected] 7/6/2004 12:00:18 PM >>>
Hi all,

I am looking for a way to dice my silicon wafer with deep etched
pockets with a micron thick 8 mm by 8 mm silicon nitride membrane on one
side. I tried to use the wax to fill in the cavities and dice. But, I
observed the membranes break. Our dicing saw uses a high pressure water
stream to cool the diamond blade. I would appreciate if anyone has any
suggestions.

Thanks in advance,
-Mahavir Sanghavi
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