> I have a 2µm thick layer of structured Aluminum on top of a Si-wafer. On
> top of the Aluminum there is about 20-30nm of Titanium.
> 1. Does anyone know how to (chemically?) remove the Titanium without
> chaning the size of the Aluminium structures within less than 1µm?

I don't know a chemistry that would do the job with proper selectivity.
You may have to resort to Ar sputter etching / ion milling.

> 2. I read that the conductivity of sputtered Aluminum can be enhanced by
> tempering it. Does anyone know some figures how much the conductivity
> changes?

Ideally, from whatever value you start at to close to the bulk value.
On modern semiconductor sputtering equipment, the as-deposited conductivity
is already very close to bulk value, and will change only minimally during
anneal, especially if deposited at >400deg.C.

best regards,
klaus

--
Klaus Beschorner
Metron Technology Europe, PVD (Eclipse) Process Manager
Drosselweg 6,71120 Grafenau,Germany. Tel +49-7033-45683