Hi colleagues:
Can anybody provide info. about the post cleaning process to remvoe particles
after wafer polishing? I ued colloidal silica polishing subspension to polish
my wafer with 2um silica layer. I just want to remove a very thin layer of
silica, not all the silica layer. After polishing, there are lots of particle
left, which cannot be removed by ultrasonic cleaning with Acetone. Any
suggestion will be appreciated.

Regards,
Yilei Zhang