Hi Lydia,
First, SiO2 at the backside can be used as etching stop layer, and
secondly, if you remove all SiO2 at the backside, may be it will induce a
curved wafer due to the bilayer SIO2/Si; it depands on the SiO2 mask area.
Olivier
> Dear all,
>
> I oxidized silicon (1 micron)for DRIE. Do I have to remove the sio2 at
> the backside? or it does not matter?
>
> Thanks,
>
> Lydia
>
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