Dear colleges,
      I use 80um thick device layer SOI wafer to fabricate a MEMS structure
with DRIE. The box layer is 1.2um thick.The trenches in the structure is
80um deep and 5um wide.When I release the structure with HF solution, I
find it can't be released after many hours!what is the problem? The
depth/width ratio is too high?
Thanks for your possible help!
                                                                Weidong
Shen
                                                       Zhejiang
University,Hangzhou,P.R.China

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