Hi, my friend,

Thanks for your advice, it is really a good idea. I have considered
self-assembly monolayers (SAMs), and I know that it is a popular means for a
better release abroad. However, in China, I've never heard of any practical
use; therefore, could you tell me something about where to get and how to use
such a material, the more detailed, the better.

Thanks,

Liuqiang Zhang


Uthara Srinivasan wrote:

> Hello,
>
> Have you considered coating the devices with self-assembled monolayers
> (SAMs)? That should solve the stiction problems and doesn't require use of
> supercritical drying.
>
> good luck,
> Uthara Srinivasan
>
> On Mon, 2 Nov 1998 [email protected] wrote:
>
> > Dear colleague,
> >
> > I am working on the processing of a MEMS-based infrared image device,
> > everything goes through well but the release of the device. Here are
> > the problems: first, since the micro-machined structures are very
> > flimsy, I couldn't stir the resolution violently, thus bubbles arising
> > in the etching process of SiO2 not only prevented the uniform etching
> > but also destroyed the structures; second, as I haven't a
> > supercritical desiccator or a squeezing drier, after removing of the
> > sacrificial layers, the suspending structure always corrupted because
> > of the capillary forces.
> >
> > Are there any good ideas on the release/drying process? Your help is
> > highly appreciated.
> >
> > Best regards.
> >
> > Liuqiang Zhang, Ph.D. Candidate,
> >
> > State Key Laboratories of Transducer Technology,
> >
> > Shanghai Institute of Metallurgy, Academia Sinica
> >
> > Email: [email protected]
> >
> > Tel: +86-21-625-11070 ext. 8603
> >
> >