Dear Colleagues,

I am trying to make a very thick photoresist (using 1075 positive thick PR)
and eventually will exposed it using a clear field mask,
the thickness am looking so far is from 30-100 microns, if anyone has any
tips for me to make this process a success (exposure time, soft bake and
post bake temp and time, ect..), that'll be great, thanks

Amani Salim
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Research Assistant
Department of Electrical and Computer Eng.
U of Minnesota,T.C.
UMBM Lab
Office phone: 612 626-0590
Lab phone: 612-626-7188