Dear all,

could anyone help me please.
I am doing some electroplating using SU-8 mould.
gold is evaporated before SU-8 is deposited.
after the developing step,
many SU-8 parts fall off of the wafer with gold film attached to them,
how do i improve the adhesion between Si and the gold film,
so that i have a a complete patterned wafer??

thanks for the help.

Chen han

Derek
Try depositing a thin layer of Chrome before depositing the gold.