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MEMSnet Home: MEMS-Talk: adhesion between Si wafer and gold film
adhesion between Si wafer and gold film
2004-08-31
Chen-Han Lee
2004-08-31
Anthony Cooper
2004-08-31
Michael Cooke
2004-08-31
Flavio Giacomozzi
2004-09-01
vijay j
2004-08-31
Kasman , Elina
2004-08-31
[email protected]
adhesion between Si wafer and gold film
[email protected]
2004-08-31
You might try a 400 angstrom layer of Ti followed by a 600 angstrom layer of Ni
and then the gold. These can all be done in the evaporator if you have a
multiple pocket ebeam configuration. Bob Henderson

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