hi all,


 I am doing my work on design and development of RF MEMS Capacitive switch. For
that I optimised the layout in an EM Simulator (Intellisuite) . Next I am going
to fabricate the same. Here I need the guidance about what all are the materials
involved and Process Flow for fabricate the switch.

The guidance I expect you is may be some Books, transactions, journals or any
websites deal the Process Flow.

Thanks in advance,


S.Karthikeyan,
Project Associate,
Thiagarajar College of Engg.,
Madurai,
India.



On Mon, 30 Aug 2004 [email protected] wrote :
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>Today's Topics:
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>    1. equipartion theoram (rakesh babu)
>    2. wet etch that etches Al but not ZnO (Raegan Johnson)
>    3. MF 351 or AZ 351 (Joolien Chee)
>
>
>----------------------------------------------------------------------
>
>Message: 1
>Date: Sat, 28 Aug 2004 21:45:44 -0700 (PDT)
> From: rakesh babu 
>Subject: [mems-talk] equipartion theoram
>To: [email protected]
>Message-ID: <[email protected]>
>Content-Type: text/plain; charset=us-ascii
>
>Folks,
>
>  Does anyone have an idea regarding equipartion energy and its relation to the
thermal noise in cantilevers.
>
>regards
>rakesh
>
>Peter Svasek  wrote:
>Hi,
>
>SILICON RESOURCES (www.siliconresources.com) offer an adhesion promoter
>(AP 300) for SU-8
>on glass.
>Did you try slow temperature ramps during PEB ? your problem might also
>be caused by stress because of
>the high CTE of SU-8.
>
>Best regards
>Peter
>
>--
>Vienna University of Technology
>Institute of Sensor and Actuator Systems
>Gusshausstrasse 27-29/366
>A-1040 Wien
>Austria
>
>Tel. +43-1-58801-36643
>Fax +43-1-58801-36699
>
>
>
>
>Arne Schleunitz wrote:
>
> >Hi,
> >
> >I have adhesion problems of 120um thick and 50um wide SU-8 50 structures on
pyrex.
> >I have a long dehydration time (at least one hour), a high exposure dose
(600mJ/cm2) and even tried stepwise exposure.
> >Although I could improve the adhesion some parts still peel of during the
development.
> >I know, that by increasing the exposure dose I could get better adhesion, but
an unwanted side effect would be rough sidewalls that I try to prevent...
> >
> >I appreciate any comments!!! Thanks in advance.
> >
> >Arne
> >
> >---
> >
> >Arne Schleunitz
> >
> >MEMS Sensors and Actuators Lab
> >
> >Department of Electrical and Computer Engineering
> >
> >University of Maryland
> >
> >Tel: (301) 405-1897
> >
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>------------------------------
>
>Message: 2
>Date: Sun, 29 Aug 2004 13:51:08 -0500 (CDT)
> From: "Raegan Johnson" 
>Subject: [mems-talk] wet etch that etches Al but not ZnO
>To: [email protected]
>Message-ID: <[email protected]>
>
>Does anyone know of a wet etch solution that will etch aluminum but not ZnO?
>
>thanks,
>Raegan
>
>
>
>
>------------------------------
>
>Message: 3
>Date: Sun, 29 Aug 2004 21:57:27 -0500
> From: Joolien Chee 
>Subject: [mems-talk] MF 351 or AZ 351
>To: [email protected]
>Message-ID: <[email protected]>
>Content-Type: text/plain; charset=US-ASCII; format=flowed
>
>Hi all,
>
>I would like to know what is the difference between Microposit MF 351
>and Shipley AZ 351. The target photoresist is Shipley 1813.
>
>Thank you all in advance.
>
>Joolien
>
>
>
>------------------------------
>
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>End of MEMS-talk Digest, Vol 22, Issue 26
>*****************************************