A few differences:
Electroplated gold can be a lot rougher than evaporated gold. This will give
a lower reflectance.
Electroplated gold tends to be less dense and have a higher resistivity.
The residual stress for either method can be varied to some degree with the
deposition conditions.
In my experience, it is easier to get good thickness uniformity with
evaporation or sputtering than with electroplating:
the electroplated gold thickness can vary with distance from the electrical
contacts, feature size, where the features are in the solution flow field,
and across features.
A professionally built system (such as those by EEJA) will give better
electroplating results, but these systems are expensive.
    --Kirt Williams

----- Original Message -----
From: "Bravo Han" 
To: 
Sent: Thursday, September 02, 2004 6:14 PM
Subject: [mems-talk] Electroplating Gold vs. E-Beam Evaporation Gold


> Hi folks,
>
> To obtain a layer of Au that is not too thick, for example, just
> around 2 microns, are there any significant differences in the final
> metal film deposited by electroplating vs. the one by e-beam
> evaporation?
>
> Thanks for your attentions and inputs.
> _______________________________________________
> [email protected] mailing list: to unsubscribe or change your list
> options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
> Hosted by the MEMS Exchange, providers of MEMS processing services.
> Visit us at http://www.memsnet.org/