Greetings -

I am e-beam evaporating Au-Cu (30-70) after melting Au and Cu slugs
together in a graphite crucible. It's a standard Temescal gun, pressure
is <2 x 10-6 T and rate is 1-2 nm/sec.

I get a nice smooth, 1 micron thick film except the surface is covered
with  many .25-.5 micron bumps spaced about 25 microns apart. I can see
small particles flying off the melted slug as I evaporate, even at low
rate. We routinely evaporate similar films of pure Au and pure Cu with
no problem.

Any suggestions?

thanks very much,
-Jim Beall