Hi Jim,
       I would suggest to go for lower deposition rate
and also maintain the constant rate throughout the
deposition time.

Regards
Hare Krishna









--- Jim Beall  wrote:

> Greetings -
>
> I am e-beam evaporating Au-Cu (30-70) after melting
> Au and Cu slugs
> together in a graphite crucible. It's a standard
> Temescal gun, pressure
> is <2 x 10-6 T and rate is 1-2 nm/sec.
>
> I get a nice smooth, 1 micron thick film except the
> surface is covered
> with  many .25-.5 micron bumps spaced about 25
> microns apart. I can see
> small particles flying off the melted slug as I
> evaporate, even at low
> rate. We routinely evaporate similar films of pure
> Au and pure Cu with
> no problem.
>
> Any suggestions?
>
> thanks very much,
> -Jim Beall
>
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