You can remove the individual chips from the adhesive tape by simple
peeling with tweezers and then rinse with DI water and ultrasonic
aggitation. I usually coat the front and/or backside of the wafer with
photoresist to protect during dicing and them simply put it into the
photoresist remover and the surface is clean and untouched by dicing
debris...

Elina


-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Markus Lohi
Sent: Wednesday, September 22, 2004 11:36 AM
To: [email protected]
Subject: [mems-talk] Diced wafer cleaning options


Hi all,

I am looking into different wafer cleaning options for diced silicon
wafers. Could somebody advise me with the most usual methods/equipment
and their pros and cons? We need a cheap process for low volume washing.
The wafer is mounted on an adhesive tape.

Thanks,
Markus
_______________________________________________
[email protected] mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.memsnet.org/