Hi all,
        I am trying to do a lift off of 2 um Cu / 200 A Cr layer with 5 um
features using a bi layer lift off process using Microchem LOR 20 B and Shipley
1813. Does anybody have any experience using this .Could you pls share your
process details.
     Also what are the limitations of aspect ratio on bi layer photolithography
process? Is it possible to do 3 um features of 2 um thick metal using this
process.
         Thanks in advance,
                 Dipankar Ghosh
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