Hi Dipankar,

which can of solution is this commercial product? what is the
composition of your feature above the Cu/Cr layer?

Dr Laetitia Philippe
Electrochemistry and Micro-patterning Group
EMPA

Feuerwerkstrasse 39
CH-3602 Thun

Tel 41 (0)332285249

>>> [email protected] 09/28 5:11 am >>>
Hi all,
        I am trying to do a lift off of 2 um Cu / 200 A Cr layer with 5
um features using a bi layer lift off process using Microchem LOR 20 B
and Shipley 1813. Does anybody have any experience using this .Could you
pls share your process details.
     Also what are the limitations of aspect ratio on bi layer
photolithography process? Is it possible to do 3 um features of 2 um
thick metal using this process.
         Thanks in advance,
                 Dipankar Ghosh
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