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MEMSnet Home: MEMS-Talk: 8" Wafer thinning with desired backside roughnessservice
8" Wafer thinning with desired backside roughness service
2004-09-23
roy lam
8" Wafer thinning with desired backside roughnessservice
2004-10-02
ShuTing
8" Wafer thinning with desired backside roughnessservice
ShuTing
2004-10-02
I used the service offered by Aptek Industries for lapping.
I am not sure whether they can control the roughness to your request.
But they do have different polishing pads that would yield
different results.

Here's the website. Good luck with your research.
http://www.aptekindustries.com/


ShuTing

-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of roy lam
Sent: Wednesday, September 22, 2004 6:25 PM
To: MEMS Talker
Subject: [mems-talk] 8" Wafer thinning with desired backside
roughnessservice


Dear Talker,

Anyone know where has service to thin down 8" wafer
thinning to 200-220um with backside roughness
Ra~0.5um?

Feel free to contact me direct by email at
[email protected] if you have any information.

Thanks in advance

Roy Lam

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