Dear Novak,

Shipley S1800 photoresists do not work with CN based gold plating
solution. You should change your photoresist. Please check the
datasheets of photoresists if they can withstand against CN based gold
plating solution. One alternative is SJR5740. It works well.

Do not hesitate to ask if you have any questions..

Mehmet Unlu
Research Assistant
Ph. D. student
MEMS-VLSI Group
Electrical-Electronics Eng. Dept.
Middle East Technical University
Ankara, Turkey

Tel:  90 312 210 45 26 or 44 09
Fax: 90 312 210 12 61

> Message: 3
> Date: Tue,  5 Oct 2004 17:34:28 +0100
> From: Novak Farrington 
> Subject: [mems-talk] CN based gold plating with shipley 1823 problem
> To: [email protected]
> Message-ID: <[email protected]>
> Content-Type: text/plain; charset="ISO-8859-1"
>
> Dear all,
>
> after looking through the archive I can't seem to find a direct
answer to my
> particular problem. I'm trying to plate up to 0.9um through shipley
1813 resist
> but am having the seemingly common problem of underplating and even
a breaking
> off of the resist in the areas around the plated regions during the
subsequent
> rinse.
>
> The substrate is glass with a silver seed layer and the process as
follows:
>
> cleaning and dehydration of glass (150 C for 30 mins)
> thermal evaporation of silver to ~300nm
> dehydration of sample (150 C for 30 mins)
> application of S1813 at 3000 rpm
> bake at 100 C for 1 min
> exposure
> development
> hardbake at 120 C for 5 mins
>
> electoplating using PURAMET 402 (pH 7.5, 55 C, 1mA/cm^2, 15 mins)
> rinse
>
> Thanks,
>
> Novak
>
>
> _____________________________________
>
> Novak Farrington
> Institute of Microwaves and Photonics
> School of Electronic and Electrical Engineering
> University of Leeds
> Leeds LS2 9JT
> UK
>
> Mob. 0790 9948673
> Fax. +44 (0)113 343 7265
> email: [email protected]