Dear All,
  I'm doing a project of sputtering SiO2 layer on Au. I have an adhension layer
(~5nm) of Cr or Ti underneath the Au and the substrate i use is glass. My
problem is after coating of SiO2 the Au layer seemed peel off and the surface
is very rough.
 My questions are:
 1. Is the stress between Au and SiO2 too high? Even with the adhesion layer it
wouldnt help the Au to stick when sputtering SiO2?
 2. Did the Cr diffuse out because of the temperature?
 3. Is there any way i could try to solve this prob?

thanks for the help.

claire