Claire,

Have you measured the film stress of the Au with adhesion layer and the
SiO2 separately?  That would go a long way in helping to identify and
correct your stress peeling issues.  Also, at what temperature are you
depositing?  I would determine taht it is indeed stress caused, then if so,
alter my deposition parameters to minimize the stress differential.  There
are many knobs to turn with respect to the sputter variables, so it
shouldn't be hard to change things.

Paul Sunal



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>Date: Thu, 14 Oct 2004 15:05:14 -0400
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>Subject: [mems-talk] Sputtering SiO2 on Au
>Message: 5
>
>
>Dear All,
>   I'm doing a project of sputtering SiO2 layer on Au. I have an adhension
> layer
>(~5nm) of Cr or Ti underneath the Au and the substrate i use is glass. My
>problem is after coating of SiO2 the Au layer seemed peel off and the surface
>is very rough.
>  My questions are:
>  1. Is the stress between Au and SiO2 too high? Even with the adhesion
> layer it
>wouldnt help the Au to stick when sputtering SiO2?
>  2. Did the Cr diffuse out because of the temperature?
>  3. Is there any way i could try to solve this prob?
>
>thanks for the help.
>
>claire

Ph.D. Candidate
Engineering Science and Mechanics
Pennsylvania State University
266 MRL Building
University Park, PA 16802
814.865.0755