To use KOH to etch through the handle wafer takes long time so you face the
front side protection issue and uneven silicon etch issue. The better way to
do this is to do backside grind, to the minimum thickness that you can
handle and then do KOH etch.

Hong Wu

-----Original Message-----
From: [email protected]
[mailto:[email protected]]On Behalf Of Ying Cai
Sent: Saturday, October 16, 2004 9:51 AM
To: [email protected]
Subject: [mems-talk] A question on SOI wafer


Hi, dear all,



Now I have a SOI wafer in hand.  I need to get the device layer only.  What
should I do to remove the handle layer and BOX?



One way to do is to use KOH to remove the handle layer first, then use HF to
remove the BOX?  Is there any other process to do this?



Thank you very much.



Sincerely,



Ying Cai

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