Hi Sreeram,
        I am trying to plate copper on top of chrome and copper. I am
worried about oxidation of the copper seed layer before plating. Should I
treat the copper seed layer with some chemical?
        Thanks.

Jack




---original message----
Hey Ashari

   Aluminum is soluble in both acidic and basic solutions and is not an
ideal seed layer. The typical seed layer used for electroplating is titanium
followed by copper.

   Regards
   Sreeram

-----Original Message-----
From: mems-talk-bounces+sappasam=ececs.uc.edu at memsnet.org

[mailto:mems-talk-bounces+sappasam=ececs.uc.edu at memsnet.org
 ] Sent: Tuesday,
December 16, 2003 2:59 AM
To: mems-talk at memsnet.org

Subject: [mems-talk] seed layer for nickel elctroplating

Is there a way to electroplate nickel onto aluminium
coated wafer as im unable to do so currently. Whats
the best seed layer for nickel electroplating.

=====
ashari keling