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MEMSnet Home: MEMS-Talk: seed layer for nickel elctroplating
seed layer for nickel elctroplating
2004-10-18
Jack Peng
2004-10-19
[email protected]
2004-10-21
IGOR KADIJA
2004-10-18
Borski, Justin
seed layer for nickel elctroplating
[email protected]
2004-10-19
Hi Jack,
Before electroplating the copper  remove  the oxide layer using  3 %
hydrochloric acid.

Regards,
Veena
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