Hi,

 I am having problems with developing photoresist on quartz wafer. The
photoresist is not sticking to the quartz. I am making using of TLM mask for the
photolithographic prosess. I need the smallest seperation in the pattern (2um
separation).Has anyone experienced similar
problems? In particular, with AZ 5214E which i want to use for patterning
metal using liftoff. The procedure that i followed is:

a) organic cleaning of wafer(acetone(30s) then methanol(30s))
b) spin-on HMDS+AZ5214
c) soft back @ 90C/60sec
d) Expose for 15sec
e)Develop for 30s

 Your help is deeply appreciated.

 thanks

Isi Abhulimen



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