Hello Andrew,

I am currently working with optical grade Lithium Niobate wafers.  I am using an
UltraTec Diamond saw to dice the samples.  The wafers do not cleave easily like
Si, so you will have trouble if you are just using a scribe to try to cut your
wafers.  My wafers are 1mm thick and I have no problem making nice clean cuts.
It is a good idea to coat with pr before cutting like Novak said.

Sincerely,

Jeff Price
Research Assistant, University of Delaware




Does anyone have any experience of scribing Lithium Niobate SAW wafers (128
Y-X). The wafers are 0.5 mm thick.  We would be grateful for any tips!