Hello Andrew,
I once used a dicing saw to cut ceramic wafer, it works fine. A simple
diamond pen can't do that job in my case. Dicing saw is more powerful
if the wafer is pretty hard.
I also applied AZ4620 PR before cutting.

Regards,

FAN, Yong
Turbulence and Heat Transfer Laboratory. / Frontier Energy System
Laboratory.
Department of Mechanical Engineering, The University of Tokyo.
Tel: +81-3-5841-6419, 6418, 6417, 6411.
Fax: +81-3-5800-6999
Email: [email protected]

On 2004/10/21, at 3:21, Jeffrey Price wrote:

> Hello Andrew,
>
> I am currently working with optical grade Lithium Niobate wafers.  I
> am using an UltraTec Diamond saw to dice the samples.  The wafers do
> not cleave easily like Si, so you will have trouble if you are just
> using a scribe to try to cut your wafers.  My wafers are 1mm thick and
> I have no problem making nice clean cuts.  It is a good idea to coat
> with pr before cutting like Novak said.
>
> Sincerely,
>
> Jeff Price
> Research Assistant, University of Delaware
>
>
>
>
> Does anyone have any experience of scribing Lithium Niobate SAW wafers
> (128
> Y-X). The wafers are 0.5 mm thick.  We would be grateful for any tips!
>
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