Hi All,
I am wondering if die attach with AuSn eutectic is used or if it is
necessary in the MEMS area. I understand that Au/Sn: 80/20 preforms are used
for die attach of stacked die where the reliability at higher temperature is
an issue.
We are developing a sputtering solution where we deposit a thick alloy of Au
and Sn in place of preforms. I will appreciate if anybody in the
mems-network could give suggestions or share their experience on this
aspect.
Thanks
Ravi Mullapudi
Hionix, Inc.
2157 O'Toole Avenue, Suite:E, San Jose, CA 95131
Phone: 408-910-8070 Fax:408-762-4305 www.hionix.com
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