Hello, in our group we use vapour hf, and it seems to work well. It is a
home made device, but we are selling the devices as well.

Anpan

-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Oudalov, A. (EL)
Sent: dimanche, 24. octobre 2004 18:50
To: '[email protected]'
Subject: [mems-talk] Sticking of fragile MEMS structures


Hi there,

I am trying to release a comb drive structure etched by deep reactive
ion etching (DRIE) on a SOI silicon wafer. I try to make very thin gaps
between the comb drives to have a large electrostatic force. Since the
spring constant of my supporting structure is small I get problems when
I release the chips in buffered hydro-fluoric acid (BHF). The adjacent
combs stick permanently and the device is broken. I also tried critical
point drying, the yield is little higher but not satisfactory. Who knows
about another, more gentle method to release my combs?

Thanks a lot,
Alexander

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