We ebeam boron all the time.  It spits a lot and causes pressure spikes
( I assume this is due to captured gas "bubbles" in the boron). It is
pretty high stress, but we are able to get it to stick very nicely to
all types of substrates, including polyimide (kapton).  We have some
boron material out right now for "melting" which we hope will reduce the
pressure spikes and some of the spitting.  But, all in all - we are able
to deposit nice films up to a couple of microns in thickness.

I hope this helps.

Charles Ellis....
Auburn University....


-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of John Chiaverini
Sent: Monday, October 25, 2004 11:09 AM
To: '[email protected]'
Subject: [mems-talk] Boron evaporation?

Hi, does anybody have any experience with evaporation of boron?  It
seems
that it's tough to get to the required ~1800 C with thermal evap.  Is it

usually done with ebeam?  How about PLD?

Any related info. appreciated,
John


John Chiaverini
NIST Boulder, Time and Frequency Division
Ion Storage Group, Quantum Computation Project
[email protected]
(303) 497-4364


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