Is there any reason you cannot use 30% H2O2 for the TiW etch?

>Hi all,
>
>We are trying to etch a TiW adhesion layer on an Alumni substrate using
>Clariant's TiW etchant.  We're observing a residue film (pinkish on the
>white Alumina) that can be rubbed off using a Q-tip.  However, we don't
>know how to remove this film from our patterned substrates.  We've tried
>acetone, stripper, and RIE in an oxygen plasma, but the film remains.
>It seems manually wiping off the film has the best results, but this
>ruins the structures (1.5um of Au with TiW adhesion layer).
>


--
Mark Fuller
Microelectronics Fabrication Facility
Washington State University
Dana Hall 102
Pullman, WA  99164-2711
(509)335-1797