Laser drilling could make small with high aspect ration in wafers 700
microns. I have seen 5 mic holes through glass wafers, but it will
probably also take out the Al2O3. If you could find a laser with a
wavelength that is transparent to Al2O3 and not to aluminium, then you
maybe lucky.

Anpan


 Hey all,
>
> I have a pattern on an aluminium-Al2O3 wafer  (array of
> holes of 50 microns). I want to etch out the aluminum that has been
> exposed by the pattern.  The layer of aluminium on the aluminum oxide
> is about 700 microns.  Does anyone know what is the best photoresist
> that will last in the RIE and how long should I leave the chips in the

> RIE to
> etch out approximately 700 microns?   Also if anyone knows
> the chemistry that I should use in the RIE to efficiently etch the
> aluminum and not the Al2O3 would be very helpful.
>
> Thank you everyone in advance.  You guys have been great help.
>
> Vivek
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