That is really thick and a challenging aspect ratio! Laser ablation will
probably not work very well. It will not produce straight walls and will
leave residue at the bottom of the hole. You might consider using
mechanical micromilling.

Contact me off line if interested.
Mike Martin


>>> [email protected] 10/27/2004 4:18:01 AM >>>
Laser drilling could make small with high aspect ration in wafers 700
microns. I have seen 5 mic holes through glass wafers, but it will
probably also take out the Al2O3. If you could find a laser with a
wavelength that is transparent to Al2O3 and not to aluminium, then you
maybe lucky.

Anpan


 Hey all,
>
> I have a pattern on an aluminium-Al2O3 wafer  (array of
> holes of 50 microns). I want to etch out the aluminum that has been
> exposed by the pattern.  The layer of aluminium on the aluminum oxide

> is about 700 microns.  Does anyone know what is the best photoresist

> that will last in the RIE and how long should I leave the chips in
the

> RIE to
> etch out approximately 700 microns?   Also if anyone knows
> the chemistry that I should use in the RIE to efficiently etch the
> aluminum and not the Al2O3 would be very helpful.
>
> Thank you everyone in advance.  You guys have been great help.
>
> Vivek
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