Dear All,

I am trying to do Cu electroplating in  200 microns  deep holes of 40
microns diameter.

1. Which Seed layer should be used ?? Cu or Gold. Cu has more
electrical conductivity than Gold but Gold is noble metal and high
oxidation resistance.

2. Do i need Cu deposition on the vertical side walls ? If yes, how
can i deposit Cu in vertical walls of deep holes.

I will be thankful if any one can send his/her valuable suggestions.

Thanks in advance.
Pradeep