Zhiyan,

        You may need reentrant PR profile to ensure no film coverage on
the PR sidewall. Or, you need an intermediate layer between PR and Ti/Au
and you purposely overetch this intermediate layer so that you have an
overhanging PR region for the stripper to reach the PR for lift-off.


Yours sincerely,

Isaac Chan

Ph.D. Candidate
Dept. Electrical & Computer Engineering
University of Waterloo
200 University Ave. W
Waterloo, Ontario, N2L 3G1, Canada
Tel: (519) 888-4567, ext. 6014
[email protected]
http://www.ece.uwaterloo.ca/~a-sidic
--------------------------------------------------------------------
My experience is on a-Si:H TFT design and semiconductor processing:
http://resumes.hotjobs.com/iwchan2004/procengineer6yr
--------------------------------------------------------------------

On Mon, 8 Nov 2004, zhiyanl wrote:

> Dear friends:
>
> I got a trouble when doing metal lift-off with very small feature size. I
> deposited Ti/Au on the patterned PR and then tried to lift off. The feature
> size if about 8~10um. But even i soaked it in the acetone for very long time,
> the PR still can't be stripped off. It seems the metal not only covered the
> top of the PR but also the side wall. I am wondering if you have any idea and
> suggestions on how to strip off the PR.
>
> Thank you very much.
>
> Zhiyan
>
> _______________________________________________
> [email protected] mailing list: to unsubscribe or change your list
> options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
> Hosted by the MEMS Exchange, providers of MEMS processing services.
> Visit us at http://www.memsnet.org/
>