Hi,
First question:
How did you put the metal? Did you sputter or use an Evaporator?

Well, I have tried lift off for my process and it works really well. My
feature size is actually smaller than yours. It is around 4 microns. I
deposit Ti/Pt 500/1000A with an evaporator.

You might want to try putting the acetone in a ultra shake, and that would
help out in getting a good lift off.

Or, try using some other chemicals such as 1112A, heat it a bit and then
put your wafer in it. Use the ultra shake in this scenario as well if you
can.

One more thing, usually I have only heard ppl using Ti/Pt or Cr/Au so you
might wanna check that out.

-Tushar

On Mon, 8 Nov 2004, zhiyanl wrote:

> Dear friends:
>
> I got a trouble when doing metal lift-off with very small feature size. I
> deposited Ti/Au on the patterned PR and then tried to lift off. The feature
> size if about 8~10um. But even i soaked it in the acetone for very long time,
> the PR still can't be stripped off. It seems the metal not only covered the
> top of the PR but also the side wall. I am wondering if you have any idea and
> suggestions on how to strip off the PR.
>
> Thank you very much.
>
> Zhiyan
>
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