Try ultrasonic agitation.  You need to make sure you have a good sidewall
profile (undercut) to get good liftoff.  Are you doing image reversal?  With
image reversal, the needed undercut profile will be there if you optimize
the process.  Without reversal, you should use a bilayer resist process.

Good luck,
Bill

-----Original Message-----
From: [email protected]
[mailto:[email protected]]On Behalf Of zhiyanl
Sent: Monday, November 08, 2004 11:10 AM
To: General MEMS discussion
Subject: [mems-talk] Metal Lift-off


Dear friends:

I got a trouble when doing metal lift-off with very small feature size. I
deposited Ti/Au on the patterned PR and then tried to lift off. The feature
size if about 8~10um. But even i soaked it in the acetone for very long
time,
the PR still can't be stripped off. It seems the metal not only covered the
top of the PR but also the side wall. I am wondering if you have any idea
and
suggestions on how to strip off the PR.

Thank you very much.

Zhiyan

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