Hi,
You can use copper bottom up plating. See our publication:
N.T.Nguyen, E.Boellaard, N.P.Pham, V.G.Kutchoukov, G.Craciun, P.M.Sarro,
"Through-wafer copper electroplating for 3-D interconnects",
J.Micromech.Microeng. 12 (2002), pp 395-399.
Nga
At 10:18 PM 11/8/04 +0800, you wrote:
>Dear Members,
>
>Does any body know how to deposit Cu on the vertical side walls of 200
>microns deep holes of Si (50 microns dia) ?
>
>Sputtering process is not giving me good results.
>
>Any suggestions will be appreciated.
>
>Pradeep
>_______________________________________________
>[email protected] mailing list: to unsubscribe or change your list
>options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
>Hosted by the MEMS Exchange, providers of MEMS processing services.
>Visit us at http://www.memsnet.org/
>
>
============================================================================
Nga. P.Pham, Ph.D
Delft University of Technology
Faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS)
Delft Institute of Microelectronics and Submicrontechnology (DIMES)
Laboratory of Electronic Components, Technology & Materials (ECTM)
Feldmannweg 17
P.O Box 5053
2600 GB DELFT
THE NETHERLANDS
phone ++31-15-2781237
fax ++31-15-2622163
e-mail [email protected]
homepage: http://www.dimes.tudelft.nl http://ectm.et.tudelft.nl
============================================================================
