Wafer back-grinding is a widely used process, feasible at most packaging
sites. Possible concerns (without knowing any specifics about your
project) about back-grinding:

- Mechanical pressure
- Contaminant from the chemicals used in the process
- Accuracy and uniformity of final thickness
- Texture required for the back-side

Regards,
Pierre x286
-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Craig Lowrie
Sent: November 11, 2004 09:32
To: [email protected]
Subject: [mems-talk] Wafer Thickness

Hello,

I am process restricted to using a 400 um thick silicon wafer but
require a thickness of 300 um.  Is there a possibility of using some
kind of post-processing "grinding" step or something similar to achieve
this? What would be the practical concerns of performing this if it is
possible?

Regards,
Craig
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