Craig,

  I would suggest the easiest way to thinning down the
wafer would be(pre processing) to dip it in TMAH. The
practical issue is roughening of the surface which you
can reduce by using a higher concentration of TMAH.

  Sincerely
  Rakesh


--- Craig Lowrie  wrote:

> Hello,
>
> I am process restricted to using a 400 um thick
> silicon wafer but
> require a thickness of 300 um.  Is there a
> possibility of using some
> kind of post-processing "grinding" step or something
> similar to achieve
> this? What would be the practical concerns of
> performing this if it is
> possible?
>
> Regards,
> Craig
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